Placa Mãe Gigabyte GA-B75M-D3H (LGA 1155 DDR3 1600) Chipset Intel B75 - USB 3.0 * liquidação última peça de vitrine

*** Liquidação de última peça de vitrine - vídeo onboard não funciona ***

Placa Mãe Gigabyte GA-B75M-D3H LGA 1155 DDR3

SOFTWARE MONITOR
Monitor critical software below the OS

DATA BACKUP & RESTORE
Run after hours—even if PC is off

USB BLOCKER2
Block unwanted USB device classes

PC HEALTH CENTER
Run after hours— even if PC is off

ENERGY SAVER
Automatically power on each morning

Humidity Protection
Humidity can play havoc on a motherboard`s circuitry.GIGABYTE`s new Glass Fabric PCB design helps protect against electrical shorts due to humidity by reducing the gaps in spacing between PCB filaments.

Electrostatic Protection
GIGABYTE Ultra Durable 4 Classic motherboards feature High Resistance ICs which help protect the motherboard against electrostatic discharge

Power Failure Protection
Permanent damage from power surge or failure during BIOS update, can be avoided with GIGABYTE DaulBIOS, which automatically enables a secondary, back up BIOS.
GIGABYTE also uses Anti-Surge ICs to protect the motherboard against power surges.

High Temperature Protection
GIGABYTE uses All Solid Caps (Capacitors) and Low RDS(on) MOSFETs which are rated to work at higher temperatures, providing up to 50,000* hour component lifespan.

3rd Generation Intel® Core™ processors
New 3rd generation Intel® Core™ processors are based on the new 3rd generation Intel® Core™ processor architecture, manufactured using the latest 22nm process to create a visually optimized processor platform. Based on the mature LGA 1155 socket, 3rd generation Intel® Core™ processors feature up to four high-performance 64-bit processor cores and 8MB of L3 cache Smart Cache, and overall performance when you need it most.

Designed for PCI Express Gen.3 Support
GIGABYTE 7 series motherboards take advantage of the latest connectivity and expansion bus technologies available on the Intel platform. The 3rd generation Intel® Core™ processor platform debuts the new PCI Express gen. 3.0 expansion bus, allowing users to take advantage of the next generation, high-bandwidth discrete graphics card solutions.

Intel® Rapid Start Technology
Intel® Rapid Start Technology™ gets your device up and running faster from even the deepest sleep. This means users will be able to experience almost zero power draw from their PC, but be able to resume Windows® 7 is a few seconds without having the PC go through a full system boot. With Intel® Rapid Start Technology the previous session resumes to the exact as it was, so that applications are still in the same state and no application data is lost.

Multi-display support with AMD CrossFireX™
AMD CrossFireX™ delivers the ultimate graphics performance for gaming enthusiasts who demand the highest frame rates without compromising on resolution.

:: Technical Specification

CPU 
Support for Intel® Core™ i7 processors/Intel® Core™ i5 processors/ Intel® Core™ i3 processors/Intel® Pentium® processors/Intel® Celeron® processors in the LGA1155 package L3 cache varies with CPU

Chipset 
Intel® B75 Express Chipset

Memory 
4 x 1.5V DDR3 DIMM sockets supporting up to 32 GB of system memory
Dual channel memory architecture
Support for DDR3 1600/1333/1066 MHz memory modules
Support for non-ECC memory modules
Support for Extreme Memory Profile (XMP) memory modules

Onboard Graphics (sem funcionamento)
Integrated Graphics Processor:
1 x D-Sub port  (sem funcionamento)
1 x DVI-D port, supporting a maximum resolution of 1920x1200 (sem funcionamento)
1 x HDMI port, supporting a maximum resolution of 1920x1200 (sem funcionamento)

Audio 
Realtek ALC887 codec
High Definition Audio
2/4/5.1/7.1-channel
Support for S/PDIF Out

LAN 
1 x Realtek GbE LAN chip (10/100/1000 Mbit)

Expansion Slots 
1 x PCI Express x16 slot, running at x16 (PCIEX16)
(The PCIEX16 slot conforms to PCI Express 3.0 standard.)
1 x PCI Express x16 slot, running at x4 (PCIEX4)
(The PCIEX4 slot conforms to PCI Express 2.0 standard.)
2 x PCI slots

Multi-Graphics Technology 
Support for AMD CrossFireX™ technology

Storage Interface 
Chipset:
1 x SATA 6Gb/s connector (SATA3 0) supporting up to 1 SATA 6Gb/s device
5 x SATA 3Gb/s connectors (SATA2 1~5) supporting up to 5 SATA 3Gb/s devices

USB 
Chipset:
Up to 8 USB 2.0/1.1 ports (4 ports on the back panel, 4 ports available through the internal USB headers)
Up to 4 USB 3.0/2.0 ports (2 ports on the back panel, 2 ports available through the internal USB headers)

Internal I/O Connectors 
1 x 24-pin ATX main power connector
1 x 4-pin ATX 12V power connector
1 x SATA 6Gb/s connector
5 x SATA 3Gb/s connectors
1 x CPU fan header
1 x system fan header
1 x front panel header
1 x front panel audio header
1 x S/PDIF Out header
1 x USB 3.0/2.0 header
2 x USB 2.0/1.1 headers
1 x serial port header
1 x parallel port
1 x Trusted Platform Module (TPM) header
1 x Clear CMOS jumper

Back Panel Connectors 
1 x PS/2 keyboard/mouse port
1 x D-Sub port
1 x DVI-D port
1 x HDMI port
2 x USB 3.0/2.0 ports
4 x USB 2.0/1.1 ports
1 x RJ-45 port
3 x audio jacks (Line In/Line Out/Microphone)

I/O Controller 
iTE I/O Controller Chip